Can a high-thickness emblem save time and cost? Our answer is yes.
This is the gist of our experience with Tecfrigo. A company looking for a better-performing emblem with a problem at the application stage that was causing wasted time and waste.
Having listened to the request, we set to work immediately to try to offer more than just a technical solution.
We thought of several proposals to make the separation phase between the liner and the application tape faster and safer, even creating assembly instructions for operators. With thermal chamber tests, we researched theadhesive with the best performance according to the application surfaces. Finally, we reduced supply costs and optimized the performance of the emblem with our H-profile technology.
We tried our hardest, and the effort paid off.
Together with Tecfrigo, we were at the Host 2017 trade show to present a new surprise that we will talk about in an upcoming news…
For those who would like to learn more about this experience, we will share a more detailed case history shortly.
